Perfect Laser’s PEDB-UV-1 is a newly CCD camera automatic visual positioning industrial UV laser marking and engraving machine with high efficiency, fast speed and stable performance.

This UV fiber laser marking and engraving machine with 5-megapixel CCD camera can realize auto-focusing function, and the positioning accuracy up to 0.1mm.

The CCD camera auto vision positioning system has large scanning area (175x175mm) and no error.

The objects to be marked can be placed anywhere on the conveyor belt, the CCD camera can automatically identify and marking. It’s suitable for mass production and pipeline marking.

Due to small laser focusing spot, small thermal impact area, the UV laser source can carry out super fine marking and special material marking, which is the first choice for customers with higher requirements for the marking effect.

1. The industrial UV laser marking machine adopts 355nm pumped UV laser device as the light source, with small focusing laser spot, which can reduce the mechanical deformation of the material, with small processing heat effect.

2. Adopts a CCD camera auto vision positioning system, the objects to be marked can be placed anywhere on the conveyor belt working table, the CCD camera can automatically identify and marking, suitable for mass production and pipeline working.

3. The scanning area is large (175x175mm) and has no error.

4. It can mark easily without any positioning fixture, which greatly saves time and material cost.

5. Equipped with a conveyor belt for automatic batch marking, it has fast marking speed and high efficiency.

6. The marking area is as large as 175mm×175mm, which can meet the size requirements of precision devices.

7. Adopt high-quality water chiller CW-5000 with air-refrigerator function, it has good heat dissipation effect and higher efficiency.

8. Support AI, BMP, DST, DWG, DXF, DXP, LAS, PLT and other image formats.

9. The software both supports win 7 and win 10 systems.

This CCD camera automatic positioning UV laser engraving machine is mainly used for ultra-fine marking and engraving, especially for food, pharmaceutical packaging material marking, micro-hole drilling, high-speed division of glass materials, and complex pattern cutting of silicon wafers.